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Application

Unleash the full potential of your applications with the high-speed interface IP solutions that Qualitas Semiconductor can offer.

Our high-speed interconnect IP enables scalable, low-power, and high-bandwidth connectivity across a wide range of advanced electronic systems. It is designed to meet the performance and integration needs of today’s most demanding applications — including AI accelerators, data centers, automotive systems, and embedded edge devices.

Accelerating AI with High-Speed Interconnects

Qualitas Semiconductor’s AI/ HPC and Data Center solutions empower customers to optimize designs, enhance productivity, and leverage expert support to develop reliable, secure, and high-quality SoCs and systems. Addressing the challenges of processing massive data volumes with minimal power consumption for specialized workloads demands advanced process nodes, high-performance SERDES PHY IP, and state-of-the-art PCIe Gen4 to Gen6 PHY IP.

Products

Powering Edge Intelligence with High-speed Interconnects

Qualitas Semiconductor’s interconnect IP solutions for Mobile and Embedded Edge AI systems enable seamless, power-efficient data transfer in compact, high-density environments. Supporting AI-driven edge applications such as smart sensors, vision modules, wearables, and edge processors, our IP helps customers meet the challenges of low-latency, high-bandwidth communication under stringent power and area constraints.

Products

Powering Next-gen Automotive Systems with Reliable Interconnect IP

Qualitas Semiconductor’s interconnect IP solutions for automotive systems are designed to meet the growing demands of data-intensive, safety-critical applications. From ADAS and in-vehicle infotainment to centralized compute platforms, our IP delivers high-throughput, low-latency communication with automotive-grade reliability. The IP is developed through an FSM-based functional safety process and is on track for ASIL-D certification, with additional plans to complete both ASIL-B and ASIL-D certification for future platforms.

Products